E.O. Ristolainen: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Type of sport is related to injury profile: A study on cross country skiers, swimmers, long-distance runners and soccer players. A retrospective 12-month study

L. Ristolainen, A. Heinonen, H. Turunen, H. Mannström, B. Waller, J. A. Kettunen, U. M. Kujala

Journal:

Scandinavian Journal of Medicine & Science in Sports

Year:

2010

Language:

english

File:

PDF, 249 KB

english, 2010

2

Impact of component placement in solder joint reliability

T Alander, S Nurmi, P Heino, E Ristolainen

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 269 KB

english, 2002

3

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Minna Arra, Dongkai Shangguan, Dongji Xie, Janne Sundelin, Toivo Lepistö, Eero Ristolainen

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.90 MB

english, 2004

4

Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests

Tuominen, Aulis, Ristolainen, Eero, Lehtinen, Ville

Journal:

Soldering & Surface Mount Technology

Year:

1999

Language:

english

File:

PDF, 155 KB

english, 1999

5

Analysis of Substrates for Single Emitter Laser Diodes

Alander, Tapani M., Heino, Pekka A., Ristolainen, Eero O.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 276 KB

english, 2003

6

Fear of Injections and Needle Phobia Among Children and Adolescents: An Overview of Psychological, Behavioral, and Contextual Factors

Orenius, Tage, LicPsych,, Säilä, Hanna, Mikola, Katriina, Ristolainen, Leena

Journal:

SAGE Open Nursing

Year:

2018

Language:

english

File:

PDF, 245 KB

english, 2018

7

The effect of solder paste composition on the reliability of SnAgCu joints

S. Nurmi, J. Sundelin, E. Ristolainen, T. Lepistö

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 565 KB

english, 2004

8

Chip on flex attachment with thermoplastic ACF for RFID applications

L. Frisk, J. Järvinen, R. Ristolainen

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 1.33 MB

2002

9

Mechanical properties of nanoscale copper under shear

P. Heino, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 359 KB

english, 2000

10

Reliability of 80 μm pitch flip chip attachment on flex

Petteri Palm, Jarmo Määttänen, Aulis Tuominen, Eero Ristolainen

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 321 KB

english, 2001

11

Untreated Scheuermann’s disease: a 37-year follow-up study

L. Ristolainen, J. A. Kettunen, M. Heliövaara, U. M. Kujala, A. Heinonen, D. Schlenzka

Journal:

European Spine Journal

Year:

2012

Language:

english

File:

PDF, 171 KB

english, 2012

12

Modeling and Analyzing Vertical Interconnections

Mantysalo, M., Ristolainen, E.O.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 783 KB

english, 2006

13

Solder bump reliability-issues on bump layout

Ristolainen, E., Heino, P., Alander, T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2000

Language:

english

File:

PDF, 98 KB

english, 2000

14

Stacked Modular Package

Pienimaa, S.K., Miettinen, J., Ristolainen, E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2004

Language:

english

File:

PDF, 1.20 MB

english, 2004

15

Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, Lepistö, Toivo

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 576 KB

english, 2002

16

Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings

Arra, Minna, Castello, Todd, Shangguan, Dongkai, Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2004

Language:

english

File:

PDF, 736 KB

english, 2004

17

Effect of PCB surface finish on creep properties of lead‐free solder joints

Sundelin, Janne J., Nurmi, Sami T., Lepistö, Toivo K., Ristolainen, Eero O.

Journal:

Soldering & Surface Mount Technology

Year:

2005

Language:

english

File:

PDF, 314 KB

english, 2005

18

Emerging Cyber Threats and Cognitive Vulnerabilities || Closed, safe and secure – the Russian sense of information security

Ristolainen, Mari

Year:

2020

Language:

english

File:

PDF, 170 KB

english, 2020

19

Are bank capital requirements optimally set? Evidence from researchersâ views

Ambrocio, Gene, Hasan, Iftekhar, Jokivuolle, Esa, Ristolainen, Kim

Journal:

Journal of Financial Stability

Year:

2020

File:

PDF, 1.18 MB

2020

20

Comparison of the corrosion resistance of TiN and (Ti,Al)N coatings

I.M. Penttinen, A.S. Korhonen, E. Harju, M.A. Turkia, O. Forsén, E.O. Ristolainen

Journal:

Surface and Coatings Technology

Year:

1992

Language:

english

File:

PDF, 674 KB

english, 1992

21

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints

A. Seppälä, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 489 KB

english, 2004

22

Mechanical and microstructural properties of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. Ristolainen

Journal:

Materials Science and Engineering: A

Year:

2006

Language:

english

File:

PDF, 862 KB

english, 2006

23

Balancing temperature dependence of on-wafer SOS inductors

Päivi H. Karjalainen, Eero O. Ristolainen

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 274 KB

english, 2006

24

Anisotropic conductive film flip chip joining using thin chips

Erja Jokinen, Eero Ristolainen

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 212 KB

english, 2002

25

Failure mechanisms of adhesive flip chip joints

A. Seppälä, T. Allinniemi, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 1.75 MB

2002

26

Characterization of totally chlorine-free effluents from kraft pulp bleaching III: Analytical pyrolysis of high-molecular-mass hardwood-derived material

M. Ristolainen, R. Alén, J. Toivanen

Journal:

Journal of Analytical and Applied Pyrolysis

Year:

1999

Language:

english

File:

PDF, 166 KB

english, 1999

27

The influence of titanium interlayers on the adhesion of PVD TiN coatings on oxidized stainless steel substrates

K.A. Pischow, L. Eriksson, E. Harju, A.S. Korhonen, E.O. Ristolainen

Journal:

Surface and Coatings Technology

Year:

1993

Language:

english

File:

PDF, 1.99 MB

english, 1993

28

Flip chip attachment on flexible LCP substrate using an ACF

L. Frisk, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 308 KB

english, 2005

29

Strength of Ta–Si interfaces by molecular dynamics

P. Heino, E. Ristolainen

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 119 KB

english, 2003

30

Synthesis of Thermal RC-Networks for System-in-Packages

Kyyhkynen, V., Valtanen, J., Ristolainen, E.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2004

Language:

english

File:

PDF, 356 KB

english, 2004

31

Improving the fatigue life of a bare die flip chip by thinning

Alander, T., Suominen, I., Heino, P., Ristolainen, E.

Journal:

Soldering & Surface Mount Technology

Year:

2003

Language:

english

File:

PDF, 379 KB

english, 2003

32

The effect of PCB surface finish on lead‐free solder joints

Nurmi, Sami T., Sundelin, Janne J., Ristolainen, Eero O., Lepistö, Toivo K.

Journal:

Soldering & Surface Mount Technology

Year:

2005

Language:

english

File:

PDF, 502 KB

english, 2005

33

Reliability of unencapsulated SMD plastic film capacitors

Seppälä, Anne, Saarinen, Kimmo, Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2000

Language:

english

File:

PDF, 484 KB

english, 2000

34

Reducing bonding cycle time of adhesive flip chip process

Seppälä, Anne, Aalto, Kati, Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2003

Language:

english

File:

PDF, 376 KB

english, 2003

35

Reliability of tin‐lead balled BGAs soldered with lead‐free solder paste

Tapani Nurmi, Sami, Olavi Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 377 KB

english, 2002

36

Isolated serratus palsy etiology influences its long-term outcome

Vastamäki, Martti, Ristolainen, Leena, Vastamäki, Heidi, Pikkarainen, Veera

Journal:

Journal of Shoulder and Elbow Surgery

Year:

2017

Language:

english

File:

PDF, 151 KB

english, 2017

37

Hydromorphological Classification Using Synchronous Pressure and Inertial Sensing

Ristolainen, Asko, Kalev, Kaia, Tuhtan, Jeffrey Andrew, Kuusik, Alar, Kruusmaa, Maarja

Journal:

IEEE Transactions on Geoscience and Remote Sensing

Year:

2018

Language:

english

File:

PDF, 3.69 MB

english, 2018

38

Measurement of soil electrical properties for the characterization of the conditions of food chain element transport in soils. Part I. Instrumental comparison

Ristolainen, A., Tóth, T., Farkas, Cs.

Journal:

Cereal Research Communications

Year:

2006

File:

PDF, 3.58 MB

2006

39

Long-standing groin pain in contact sports: a prospective case–control and MRI study

Paajanen, Hannu, Hermunen, Heikki, Ristolainen, Leena, Branci, Sonia

Journal:

BMJ Open Sport & Exercise Medicine

Year:

2019

Language:

english

File:

PDF, 1003 KB

english, 2019

40

Poly(vinyl alcohol) and Polyamide-66 Nanocomposites Prepared by Electrospinning

Noora Ristolainen, Pirjo Heikkilä, Ali Harlin, Jukka Seppälä

Journal:

Macromolecular Materials and Engineering

Year:

2006

Language:

english

File:

PDF, 354 KB

english, 2006

41

A comparison of shielded and conventional on-wafer test-fixture forward coupling on silicon-on-insulator (SOI) substrate

Tero Kaija, Eero O. Ristolainen

Journal:

Microwave and Optical Technology Letters

Year:

2005

Language:

english

File:

PDF, 360 KB

english, 2005

42

Alkaline earth sulfide thin films grown by atomic layer epitaxy

M. Tammenmaa, H. Antson, M. Asplund, L. Hiltunen, M. Leskelä, L. Niinistö, E. Ristolainen

Journal:

Journal of Crystal Growth

Year:

1987

Language:

english

File:

PDF, 282 KB

english, 1987

43

Depth profiling of thin film heterostructure materials by secondary ion mass spectrometry

EO Ristolainen, M Puga-Lambers, B Panthangay, PH Holloway

Journal:

Year:

1995

Language:

english

File:

PDF, 433 KB

english, 1995

44

Amorphization of silicon by high dose germanium ion implantation with no external cooling mechanism

Z. Xia, J. Saarilahti, E. Ristolainen, S. Eränen, H. Ronkainen, P. Kuivalainen, D. Paine, T. Tuomi

Journal:

Applied Surface Science

Year:

1994

Language:

english

File:

PDF, 1.21 MB

english, 1994

45

Improved corrosion resistance of physical vapour deposition coated TiN and ZrN

U.K. Wiiala, I.M. Penttinen, A.S. Korhonen, J. Aromaa, E. Ristolainen

Journal:

Surface and Coatings Technology

Year:

1990

Language:

english

File:

PDF, 823 KB

english, 1990

46

Effect of work material composition on the wear life of TiN-coated tools

E. Harju, A.S. Korhonen, Laizhu Jiang, E. Ristolainen

Journal:

Surface and Coatings Technology

Year:

1996

Language:

english

File:

PDF, 1.07 MB

english, 1996

47

Auger electron spectroscopy of silicon wafers

K.S. Valvisto, M.V. Tilli, E.O. Ristolainen

Journal:

Ultramicroscopy

Year:

1984

Language:

english

File:

PDF, 88 KB

english, 1984

48

Investigation of surface coating structure by scanning auger microscopy

E.O. Ristolainen

Journal:

Ultramicroscopy

Year:

1985

Language:

english

File:

PDF, 96 KB

english, 1985

49

Surface enrichment of the elements in welding fume particles analysed by auger electron spectroscopy

V.P. Tanninen, H.-K. Hyvärinen, A. Grekula, E. Ristolainen

Journal:

Ultramicroscopy

Year:

1985

Language:

english

File:

PDF, 97 KB

english, 1985

50

Specimen stage for air-sensitive materials

P. Suominen, A. Mäkinen, A. Lehtinen, E. Ristolainen

Journal:

Ultramicroscopy

Year:

1986

Language:

english

File:

PDF, 95 KB

english, 1986

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски